1.
Appendix III.
Dutta, Soumitra, editor. ; Lanvin, Bruno, editor. ; Wunsch-Vincent, Sacha, editor. ; León[...]
Geneva, Switzerland : World Intellectual Property Organization, 2022.
15th edition.
English | 10.34667/tind.46915 | View e-resource | Available Online |
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2.
Appendix III - Sources and definitions
Dutta, Soumitra, editor. ; Lanvin, Bruno, editor. ; Wunsch-Vincent, Sacha, editor. ; León[...]
Geneva, Switzerland : World Intellectual Property Organization, 2021.
Fourteenth edition.
English | 10.34667/tind.46985 |
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3.
Appendix IV.
Dutta, Soumitra, editor. ; Lanvin, Bruno, editor. ; Wunsch-Vincent, Sacha, editor. ; León[...]
Geneva, Switzerland : World Intellectual Property Organization, 2022.
15th edition.
English | 10.34667/tind.46914 | View e-resource | Available Online |
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4.
Appendix IV - Global Innovation Index science and technology cluster methodology
Dutta, Soumitra, editor. ; Lanvin, Bruno, editor. ; Wunsch-Vincent, Sacha, editor. ; León[...]
Geneva, Switzerland : World Intellectual Property Organization, 2021.
Fourteenth edition.
English | 10.34667/tind.46986 |
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5.
Cluster ranking.
Dutta, Soumitra, editor. ; Lanvin, Bruno, editor. ; Wunsch-Vincent, Sacha, editor. ; León[...]
Geneva, Switzerland : World Intellectual Property Organization, 2022.
15th edition.
English | 10.34667/tind.46904 | View e-resource | Available Online |
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6.
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7.
Development Microeconomics
Bardhan, Pranab K., Udry, Christopher.
Oxford : Oxford University Press, 1999.
English | B 75 BAR.D |
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8.
Effectif de l'OMPI en 2023 : Édition de décembre.
Organisation Mondiale de la Propriété Intellectuelle
Geneva, Switzerland : Organisation Mondiale de la Propriété Intellectuelle, 2023.
French | 10.34667/tind.49325 |
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9.
Effectif de l'OMPI en 2023 : Édition de juin.
Organisation Mondiale de la Propriété Intellectuelle
Geneva, Switzerland : Organisation Mondiale de la Propriété Intellectuelle, 2023.
French | 10.34667/tind.48413 |
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10.
Effectif de l'OMPI en 2022 : Édition de décembre.
Organisation Mondiale de la Propriété Intellectuelle
Geneva, Switzerland : Organisation Mondiale de la Propriété Intellectuelle, 2023.
French | 10.34667/tind.48145 |
Detailed record - Similar records