1.
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New York : Hill and Wang, 2003.
English | 346.730482|N 141 GOL.C |
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2.
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Paris : Flammarion, 2024.
French | N 141 REN.B |
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3.
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Geneva, Switzerland : World Intellectual Property Organization, 2024.
English | 10.34667/tind.49535 |
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4.
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Geneva, Switzerland : World Intellectual Property Organization, 2024.
English | 10.34667/tind.49534 |
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5.
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Geneva, Switzerland : World Intellectual Property Organization, 2024 edition
English | 10.34667/tind.49528 |
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6.
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Geneva, Switzerland : World Intellectual Property Organization, 2024.
English | 10.34667/tind.49527 |
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7.
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Geneva, Switzerland : World Intellectual Property Organization, 2024.
English | 10.34667/tind.49526 |
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8.
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Geneva, Switzerland : World Intellectual Property Organization, 2024.
English | 10.34667/tind.49525 |
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9.
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Geneva, Switzerland : World Intellectual Property Organization, 2024.
English | 10.34667/tind.49524 |
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10.
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Geneva, Switzerland : World Intellectual Property Organization, 2024.
English | 10.34667/tind.49523 |
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