000020822 000__ 03137cam\a22004935i\4500
000020822 001__ 20822
000020822 003__ SzGeWIPO
000020822 005__ 20230403133923.0
000020822 008__ 950923s1995\\\\sz\\\\\\r\\\\u000\0\eng\d
000020822 020__ $$z9789280502985
000020822 035__ $$a(wipo)(CD )95/0935
000020822 035__ $$a(OCoLC)1158980985
000020822 040__ $$aSzGeWIPO$$beng$$erda$$cSzGeWIPO$$dCaBNVSL
000020822 041__ $$aeng
000020822 084__ $$aE 231F633 WIPO.G
000020822 090__ $$c22423$$d22423
000020822 1102_ $$aWorld Intellectual Property Organization
000020822 24510 $$aGuide on the licensing of integrated circuits
000020822 264_1 $$aGeneva, Switzerland :$$bWIPO,$$c1995-
000020822 300__ $$a1 volume (various paging) ;$$c[28] cm.
000020822 336__ $$atext$$btxt$$2rdacontent
000020822 337__ $$aunmediated$$bn$$2rdamedia
000020822 338__ $$avolume$$bnc$$2rdacarrier
000020822 4901_ $$aWIPO Publication ;$$v689 (E)
000020822 5050_ $$a1. Integrated circuits : the industrial and technological context : 1.1 The integrated circuit; 1.1.1 Types of integrated circuits; 1.1.2 Applications of integrated circuits; 1.1.3 The manufacture of integrated circuits; 1.2 A description of the industry : 1.2.1 Captive producers; 1.2.2 Merchant producers; 1.2.3 Design houses and foundries; 1.3 Integrated circuit technology : 1.3.1 Design technology; 1.3.2 Process and manufacturing technology; 1.3.3 Packaging technology; 1.4 The importance of protecting intellectual property in integrated circuits : 1.4.1 Innovative semiconductor firms; 1.4.2 Countries seeking semiconductor technology; 2. Intellectual property rights in integrated circuits : 2.1 Patent law; 2.2 Copyright law; 2.3 Trade secret law; 2.4 Trademark law; 2.5 Unfair competition law; 2.6 Sui generis laws protecting layout-designs of integrated circuits; 2.7 Protection of layout-designs under international treaties; 3. Licensing of integrated circuit technology : 3.1 The nature of a license; 3.2 Special concerns to be addressed; 3.3 Cross-licensing and second sourcing; 3.4 Licensing between customer and producer of integrated circuits; 3.5 Technology sharing initiatives; 4. Glossary of terms : Annexes : Annex I. Cross-license between foundry and customer for fabricating chips and for developing and marketing products embodying such chips : - Summary of the provisions of the agreement; - Sample agreement; Annex II. Cross-license between foundry and customer for joint product design and for development of products marketed by each party : - Summary of the provisions of the agreement; - Sample agreement; Annex III. Agreement for development of customized chip from foundry's base gate array and standard cells using customer's design : - Summary of the provisions of the agreement; - Sample agreement;.
000020822 650_0 $$aIntegrated circuits.
000020822 650_0 $$aIntellectual property.
000020822 650_0 $$aCopyright.
000020822 650_0 $$aTrademarks.
000020822 650_0 $$aPatents.
000020822 650_4 $$aINTEGRATED CIRCUITS : LICENSING
000020822 650_4 $$aWIPO DOCUMENTS : INDUSTRIAL PROPERTY : INTEGRATED CIRCUITS
000020822 650_4 $$aINTEGRATED CIRCUITS : INTELLECTUAL PROPERTY RIGHTS
000020822 650_4 $$aUNFAIR COMPETITION
000020822 650_4 $$aCOPYRIGHT LAW
000020822 650_4 $$aTRADE SECRET LAW
000020822 650_4 $$aPATENT LAW
000020822 7102_ $$aLicensing Executives Society International.
000020822 7102_ $$aOficina Mundial De La Propiedad Industrial.
000020822 830_0 $$aWIPO Publication ;$$v689 (E)
000020822 903_0 $$aWIPO PUBLICATION, NO 689(E)$$v1
000020822 942__ $$cMON
000020822 952__ $$w2006-11-03$$p1995-0935$$r0.00$$u32200$$bMAIN$$10$$kE 231F633 WIPO.G$$v1995-09-23$$ztagged$$71
000020822 980__ $$aBIB
000020822 999__ $$c22423$$d22423